Metrology & Instrumentation

 

InSight 3DAFM   
Provides unparalleled accuracy and precision required for non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features.

 

Dimension AFP   
AFM single-tool fab solution designed for chemical mechanical planarization and etch metrology at 65nm and 45nm.

 

Dimension Vx200/300 AFP   
Combines long-scanning and high-resolution capabilities for CMP control and characterization and high aspect ratio depth measurements on 200mm and 300mm substrates.

 

Dimension Vx210/310 AFP   
Combines long-scanning and high-resolution capabilities for comparison of pre-and post-CMP effects such as dishing, erosion, plugs, vias, step heights and planarity.

 

Dimension X    
Automated, in-fab metrology system to replace destructive cross-sectioning techniques, reducing etch measurement turnaround from days to minutes.

 

Dimension X3D for Data Storage   
Non-destructive, gauge-capable, automated metrology system for three-dimensional in-line characterization of critical dimensions (CD).

 

Dimension X3D Photomask   
Non-destructive automated AFM for comprehensive profile and CD metrics for a variety of materials including chrome, quartz, MoSi and photoresist.